5 mm x 7 mm ceramic package smd vcxo, ttl / hc-mos i605 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 12/10_c specifications subject to change without noti ce p age 1 pin connection 1 control voltage 2 enable / disable 3 ground 4 output 5 n.c. 6 vdd 5 . 0 8 4.2 2.0 bypass =0.01 uf 7.0 0.3 5.0 0.2 dimension units: mm recommended pad layout 5.08 2.0 max. product features: applications: small surface mount package sd/hd video based output for many fre quencies wireless base stations cmos/ttl compatible logic levels sonet /sdh compatible with leadfree processing voip t1/e1, t3/e3 frequency 1 mhz to 170.000 mhz output level hc-mos ttl ?0? = 0.1 vcc max., ?1? = 0.9 vcc min. ?0? = 0.4 vdc max., ?1? = 2.4 vdc min. duty cycle 50% 5% rise / fall time 10.0 ns max. output load 15pf, fo < 50 mhz = 10 ttl, fo > 50 mhz = 5 ttl frequency stability 50 ppm max. start-up time 10 ms max. supply voltage see input voltage table, tolerance 5 % control voltage 1.65 vdc 1.5 vdc for 3.3 vdc, 2.5 vdc 2.0 vdc for 5.0 vdc pull range see pullability table current 50 ma max** linearity 10% max. temperature operating storage see operating temperature table in part number guide -55 ? c to +125 ? c phase jitter <3 ps rms note: a 0.01 f bypass capacitor is recommended between vcc (p in 6) and gnd (pin 3) to minimize power supply noise. * not available at all frequencies. ** frequency, supply, and load related parameters. part number guide sample part number: i605-1bc3h-20.000 package operating temperature stability (in ppm) pullability supply voltage enable / disable frequency i605 - 1 = 0 ? c to +70 ? c *d = ? 15 b = ? 50 ppm min. 5 = 5.0 vdc h = enable - 20.000 mhz 6 = -10 ? c to +70 ? c a = ? 25 c = ? 100 ppm min. 3 = 3.3 vdc 3 = -20 ? c to +70 ? c b = ? 50 4 = -30 ? c to +75 ? c c = ? 100 2 = -40 ? c to +85 ? c
5 mm x 7 mm ceramic package smd vcxo, ttl / hc-mos i605 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 12/10_c specifications subject to change without noti ce p age 2 pb free solder reflow profile: typical application: *units are backward compatible with 240c reflow processes package information: msl = n.a. (package does not contain plastic, storage life is unlimited under normal room conditions). termination = e4 (au over ni over w base metalization). tape and reel information: environmental specifications thermal shock mil-std-883, method 1011, condition a moisture resistance mil-std-883, method 1004 mechanical shock mil-std-883, method 2002, condition b mechanical vibration mil-std-883, method 2007, condition a resistance to soldering heat j-std-020c, tabl e 5-2 pb-free devices (except 2 cycles max) hazardous substance pb-free / rohs / green compliant solderability jesd22-b102-d method 2 (preconditioning e) terminal strength mil-std-883, method 2004, test condition d gross leak mil-std-883, method 1014, condition c fine leak mil-std-883, method 1014, condition a2, r1=2x10-8 atm cc/s solvent resistance mil-std-202, method 215 marking line 1: ilsi and date code line 2: frequency quantity per reel 1000 a 16 +/-.3 b 8 +/-.2 c 7.5 +/-.2 d 17.5 +/-1 e 50 / 60 / 80 f 180 / 250
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